Supply of Shin-Etsu thermal silica film TC-20EG, imported from Japan's Shin-Etsu fins TC-20EG. Thermal silica film is a silica substrate, the addition of various auxiliary metal oxides, etc., through a special process synthesis of a thermally conductive dielectric material in the industry, also known as thermal silicone pad, thermal silica gel tablets, soft thermal pad etc., is designed for use slit heat transfer design production, can fill the gap, complete heat transfer between the heating parts and cooling parts, but also as an insulating, damping, sealing and so on, to meet the equipment miniaturization and ultra thin design requirements, is very technology and usability and suitable for a wide range of thickness, it is an excellent thermal filler material. Effects of thermal silica film role: insulation, thermal conductivity, wear-resistant, fire-retardant, filling the gap, compression and cache size. Uses: electrical and electronic products for the control board, and the motor and external plate and mats, electronics, auto mechanics, computer mainframe, notebook computers, DVD, VCD and any desired material filling and cooling modules. High thermal silica pad (3.0 ~ 8.0W / MK), ordinary thermal silica gel pad (1W / MK), strong adhesive thermal silica gel pad (1.0W / MK), strength and toughness thermal silica gel pad (1.0W / MK) has thermal insulation , shock resistant, self-adhesive material soft surface (surface sticky), easy to operate, can be applied between the various parts of the surface irregularities and radiator shell from thermal filling effect. Plus some thermal silica glass fiber (or carbon fiber) to increase its mechanical strength.